Compare whoasyst a plate desoldering station 160~250°c djustable chip heating platform for chip glues removal ntislip base heating soldering plate products from over 5,000 stores

Whoasyst A Plate Desoldering Station 160~250°C Djustable Chip Heating Platform For Chip Glues Removal Ntislip Base Heating Soldering Plate

£24.49

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Product Description

Multi Scenario Compatibility: Specifically designed for phone and computer repairs, effectively remove glues from CPUs, baseband chips, and more, making it an essential tool for repair engineers Compact & Portable: Designed with an 18×21mm work area and compact body, easily fitting on any desktop without occupying much space, perfect for personals or professional repair shops Anti Static & Safe Operations: Built in anti static protections prevents electrostatic damage to sensitive electronics, ideal for repairing phone motherboards and laptop chips Fast Heating & Efficient glues Removal: Equipped with a high power heating module for rapid warming up, significantly reducing waiting time and speeding up chip glues removal for enhanced repair efficiency Temperature Control: Features 160℃50℃ adjustable heating with constant temperature technology to safely soften black glues on CPUs, hard drives, and IC chips without damaging components, improving repair success rates, Manufacturer: Whoasyst

Whoasyst A Plate Desoldering Station 160~250°C Djustable Chip Heating Platform For Chip Glues Removal Ntislip Base Heating Soldering Plate

Multi Scenario Compatibility: Specifically designed for phone and computer repairs, effectively remove glues from CPUs, baseband chips, and more, making it an essential tool for repair engineers Compact & Portable: Designed with an 18×21mm work area and compact body, easily fitting on any desktop without occupying much space, perfect for personals or professional repair shops Anti Static & Safe Operations: Built in anti static protections prevents electrostatic damage to sensitive electronics, ideal for repairing phone motherboards and laptop chips Fast Heating & Efficient glues Removal: Equipped with a high power heating module for rapid warming up, significantly reducing waiting time and speeding up chip glues removal for enhanced repair efficiency Temperature Control: Features 160℃50℃ adjustable heating with constant temperature technology to safely soften black glues on CPUs, hard drives, and IC chips without damaging components, improving repair success rates, Manufacturer: Whoasyst

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